EASTEVER ELECTRONICS · LTCC RF COMPONENTS
EASTEVER ELECTRONICS supplies compact multilayer LTCC RF balun transformers for balanced-to-unbalanced RF signal conversion, impedance matching and RF front-end integration. The EBL2875-18B100 and EBL4600-18B050 provide two RF power options for compact wireless and communication systems.
- Multilayer LTCC construction
- Compact surface-mount package
- Balanced-to-unbalanced RF conversion
- Low insertion loss design
- 1 W and 3 W power options
- RoHS-compliant construction
LTCC RF Balun Transformer Series
Product Selection
EBL2875-18B100 & EBL4600-18B050
EBL2875-18B100
1 W LTCC RF Balun Transformer
1 W RF Input Power
LTCC Technology
1.60 mm Length
RoHS Compliant
EBL2875-18B100 is intended for RF front-end circuits requiring compact balanced-to-unbalanced conversion with moderate RF power handling. Its multilayer ceramic structure helps reduce PCB footprint while supporting repeatable SMD assembly.
| RF Input Power | 1 W CW @ 25°C |
| Operating Temperature | -40°C to +125°C |
| Storage Temperature | -55°C to +125°C |
| Technology | Multilayer LTCC |
| Package | 1.60 × 0.80 × 0.60 mm |
EBL4600-18B050
3 W LTCC RF Balun Transformer
3 W RF Input Power
LTCC Technology
1.60 mm Length
RoHS Compliant
EBL4600-18B050 provides higher RF power handling in the same compact LTCC package. It is suitable for transmit paths, communication modules and other RF circuits where board area, consistency and thermal stability are important.
| RF Input Power | 3 W CW @ 25°C |
| Operating Temperature | -40°C to +105°C |
| Storage Temperature | -55°C to +125°C |
| Technology | Multilayer LTCC |
| Package | 1.60 × 0.80 × 0.60 mm |
Engineering Overview
Compact RF Signal Conversion for Modern Wireless Designs
Why Use an LTCC Balun?
RF baluns provide the electrical interface between balanced RF IC ports and single-ended transmission structures. In compact wireless products, conventional wound transformers may consume excessive board space.
LTCC technology integrates the required RF structure into a multilayer ceramic package. This allows engineers to reduce component size while maintaining repeatable RF characteristics during automated PCB assembly.
Typical design considerations include insertion loss, return loss, impedance transformation, power handling, operating frequency and package footprint.
Typical Applications
RF Front-End & Wireless Communication Applications
01 RF Front-End Modules
Interface between balanced RF IC outputs and single-ended RF signal paths.
02 Wireless Communication
Suitable for cellular, IoT and compact wireless communication modules.
03 RF Transceivers
Used around RF transceiver ICs requiring balanced and unbalanced signal conversion.
04 Communication Equipment
Compact LTCC structure supports dense PCB layouts and automated SMD production.
Technical Reference
RF Test Data & Product Documentation
RF test data / S-parameter measurement
Product application / PCB reference
EASTEVER ELECTRONICS supplies LTCC RF baluns and other passive RF components for communication and industrial RF applications. Product selection should be confirmed against the latest datasheet, target frequency range, impedance and RF power requirements.
